Abstract — Nanoelectronic design faces unprecedented reliability challenges and must achieve noise immunity and delay insensitiveness in the presence of prevalent defects and sig...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Due to the lack of explicit spatial consideration, existing
epitome model may fail for image recognition and target detection,
which directly motivates us to propose the so-calle...
Xinqi Chu, Shuicheng Yan, Liyuan Li, Kap Luk Chan,...
ded abstract of this work will appear in Public Key Cryptography — PKC 2012. This is the full version. We propose a general framework that converts (ordinary) signature schemes ...
As the frequency of attacks faced by the average host connected to the Internet increases, reliance on manual intervention for response is decreasingly tenable. Operating system an...