18 search results - page 2 / 4 » On Thermal Effects in Deep Sub-Micron VLSI Interconnects |
102
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ICCAD
2006
IEEE
15 years 10 months ago
2006
IEEE
With shrinking feature size and growing integration density in the Deep Sub-Micron technologies, the global buses are fast becoming the “weakest-links” in VLSI design. They ha...
101
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ICCD
2004
IEEE
15 years 10 months ago
2004
IEEE
In Deep Sub-Micron (DSM) technologies, interconnects play a crucial role in the correct functionality and largely impact the performance of complex System-on-Chip (SoC) designs. F...
136
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GLVLSI
2003
IEEE
15 years 7 months ago
2003
IEEE
One of the fundamental problems in Deep Sub Micron (DSM) circuits is Simultaneous Switching Noise (SSN), which causes voltage fluctuations in the circuit power/ground networks. In...
ICCAD
2001
IEEE
15 years 10 months ago
2001
IEEE
In deep submicron VLSI circuits, interconnect reliability due to electromigration and thermal effects is fast becoming a serious design issue particularly for long signal lines. T...
109
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DATE
2004
IEEE
15 years 5 months ago
2004
IEEE
With the increasing power density and heat-dissipation cost of modern VLSI designs, thermal and power integrity has become serious concern. Although the impacts of thermal effects...