1529 search results - page 64 / 306 » On Timing Analysis of Combinational Circuits |
IPPS
2003
IEEE
15 years 3 months ago
2003
IEEE
With the current trend in integration of more complex systems on chip there is a need for better communication infrastructure on chip that will increase the available bandwidth an...
DAC
2007
ACM
15 years 10 months ago
2007
ACM
The ability to account for the growing impacts of multiple process variations in modern technologies is becoming an integral part of nanometer VLSI design. Under the context of ti...
DAC
2010
ACM
15 years 1 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
IPPS
2005
IEEE
15 years 3 months ago
2005
IEEE
In this paper, we study the dynamic RWA problem in WDM networks with sparse wavelength conversion and propose a novel hybrid algorithm for it based on the combination of mobile ag...
DAC
2005
ACM
15 years 10 months ago
2005
ACM
While performance specifications are verified before sign-off for a modern nanometer scale design, extensive application of optical proximity correction substantially alters the l...