Three-dimensional integrated circuits (3D-ICs) are a promising approach to address the integration challenges faced by current systems on chips (SoCs). Designing an efficient netwo...
With 90nm CMOS in production and 65nm testing in progress, power has been pushed to the forefront of design metrics. This paper will outline practical techniques that are used to ...
In this paper we present a system level technique for mapping large, multiple-IP-block designs to channel-width constrained FPGAs. Most FPGA clustering tools [2, 3, 11] aim to red...
This paper describes the design of a low-cost, low-power smart imaging core that can be embedded in cameras. The core integrates an ARM 9 processor, a camera interface and two spe...
Advanced CAD tools and high-density VLSI technologies have combined to create a new market for reusable digital designs. The economic viability of the new core-based design paradig...
John Lach, William H. Mangione-Smith, Miodrag Potk...