2593 search results - page 395 / 519 » On Two Problems of Nano-PLA Design |
162
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ICCAD
2005
IEEE
16 years 2 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
164
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IPSN
2009
Springer
16 years 25 days ago
2009
Springer
We consider the problem of monitoring spatial phenomena, such as road speeds on a highway, using wireless sensors with limited battery life. A central question is to decide where ...
173
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DRM
2005
Springer
15 years 11 months ago
2005
Springer
Interoperability is currently seen as one of the most significant problems facing the digital rights management (DRM) industry. In this paper we consider the problem of interoper...
197
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IHI
2010
15 years 27 days ago
2010
Persuasive technologies for promoting physical fitness, good nutrition, and other healthy behaviors have been growing in popularity. Despite their appeal, the evaluation of these ...
155
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DAC
2005
ACM
16 years 7 months ago
2005
ACM
As technology advances into the nanometer territory, the interconnect delay has become a first-order effect on chip performance. To handle this effect, the X-architecture has been...