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» On bounding the delay of a critical path
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ISVLSI
2007
IEEE
204views VLSI» more  ISVLSI 2007»
15 years 6 months ago
Designing Memory Subsystems Resilient to Process Variations
As technology scales, more sophisticated fabrication processes cause variations in many different parameters in the device. These variations could severely affect the performance ...
Mahmoud Ben Naser, Yao Guo, Csaba Andras Moritz
IPPS
2005
IEEE
15 years 5 months ago
Technology-based Architectural Analysis of Operand Bypass Networks for Efficient Operand Transport
As semiconductor feature sizes decrease, interconnect delay is becoming a dominant component of processor cycle times. This creates a critical need to shift microarchitectural des...
Hongkyu Kim, D. Scott Wills, Linda M. Wills
TCAD
2008
93views more  TCAD 2008»
14 years 11 months ago
Chip Optimization Through STI-Stress-Aware Placement Perturbations and Fill Insertion
Starting at the 65-nm node, stress engineering to improve the performance of transistors has been a major industry focus. An intrinsic stress source--shallow trench isolation (STI)...
Andrew B. Kahng, Puneet Sharma, Rasit Onur Topalog...
MOBICOM
2009
ACM
15 years 6 months ago
Mobility increases the connectivity of K-hop clustered wireless networks
In this paper we investigate the connectivity for large-scale clustered wireless sensor and ad hoc networks. We study the effect of mobility on the critical transmission range fo...
Qingsi Wang, Xinbing Wang, Xiaojun Lin
GLVLSI
2006
IEEE
142views VLSI» more  GLVLSI 2006»
15 years 5 months ago
Dynamic instruction schedulers in a 3-dimensional integration technology
We present the design of high-performance and energy-efficient dynamic instruction schedulers in a 3-Dimensional integration technology. Based on a previous observation that the c...
Kiran Puttaswamy, Gabriel H. Loh