As technology scales, more sophisticated fabrication processes cause variations in many different parameters in the device. These variations could severely affect the performance ...
As semiconductor feature sizes decrease, interconnect delay is becoming a dominant component of processor cycle times. This creates a critical need to shift microarchitectural des...
Starting at the 65-nm node, stress engineering to improve the performance of transistors has been a major industry focus. An intrinsic stress source--shallow trench isolation (STI)...
Andrew B. Kahng, Puneet Sharma, Rasit Onur Topalog...
In this paper we investigate the connectivity for large-scale clustered wireless sensor and ad hoc networks. We study the effect of mobility on the critical transmission range fo...
We present the design of high-performance and energy-efficient dynamic instruction schedulers in a 3-Dimensional integration technology. Based on a previous observation that the c...