— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
The class of wireless and mobile networks features a dissimilar set of characteristics and constraints compared to traditional fixed networks. The various dimensions of these char...
Matthias Hollick, Ivan Martinovic, Tronje Krop, Iv...
The DepAuDE architecture provides middleware to integrate fault tolerance support into distributed embedded automation applications. It allows error recovery to be expressed in te...
Geert Deconinck, Vincenzo De Florio, Ronnie Belman...
Abstract. Core-based multicast trees use less router state, but have significant drawbacks when compared to shortest-path trees, namely higher delay and poor fault tolerance. We e...
We present a new approach that is able to produce an increased fault tolerance in bio-inspired electronic circuits. To this end, we designed hardwarefriendly genetic regulatory net...