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93
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DATE
2000
IEEE
15 years 2 months ago
2000
IEEE
Novel methodology and algorithms to seamlessly integrate logic synthesis and physical placement through a transformational approach are presented. Contrary to most placement algor...
ICCD
2004
IEEE
15 years 6 months ago
2004
IEEE
Three dimensional vertically integrated systems allow active devices to be placed on multiple device layers. In recent years, a number of research efforts have addressed physical ...
149
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TCAD
2011
14 years 4 months ago
2011
—Escalating system-on-chip design complexity is the design community to raise the level of abstraction beyond register transfer level. Despite the unsuccessful adoptions of early...
ISPD
2010
ACM
15 years 4 months ago
2010
ACM
Timing-driven placement is a critical step in nanometerscale physical synthesis. To improve design timing on a global scale, net-weight based global timing-driven placement is a c...
ASPDAC
2006
ACM
15 years 1 months ago
2006
ACM
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...