37 search results - page 6 / 8 » On power and fault-tolerance optimization in FPGA physical s... |
DAC
2005
ACM
15 years 10 months ago
2005
ACM
Physical phenomena such as temperature have an increasingly important role in performance and reliability of modern process technologies. This trend will only strengthen with futu...
ASPDAC
2006
ACM
15 years 1 months ago
2006
ACM
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
93
Voted
DATE
2000
IEEE
15 years 2 months ago
2000
IEEE
Novel methodology and algorithms to seamlessly integrate logic synthesis and physical placement through a transformational approach are presented. Contrary to most placement algor...
GLVLSI
2009
IEEE
15 years 4 months ago
2009
IEEE
In the context of nanoscale networks-on-chip (NoCs), each link implementation solution is not just a specific synthesis optimization technique with local performance and power im...
ISLPED
2005
ACM
15 years 3 months ago
2005
ACM
Temperature is becoming a first rate design criterion in ASICs due to its negative impact on leakage power, reliability, performance, and packaging cost. Incorporating awareness o...