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» On the Complexity of Circuit Satisfiability
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ISCAS
2003
IEEE
119views Hardware» more  ISCAS 2003»
15 years 6 months ago
Electrical characteristics of multi-layer power distribution grids
Abstract— The design of robust and area efficient power distribution networks for high speed, high complexity integrated circuits has become a challenging task. The integrity of...
Andrey V. Mezhiba, Eby G. Friedman
87
Voted
ISQED
2003
IEEE
96views Hardware» more  ISQED 2003»
15 years 6 months ago
Impact of Interoperability on CAD-IP Reuse: An Academic Viewpoint
Mind-boggling complexity of EDA tools necessitates reuse of intellectual property in any large-scale commercial or academic operation. However, due to the nature of software, a to...
Andrew B. Kahng, Igor L. Markov
129
Voted
MICRO
2003
IEEE
152views Hardware» more  MICRO 2003»
15 years 6 months ago
A Systematic Methodology to Compute the Architectural Vulnerability Factors for a High-Performance Microprocessor
Single-event upsets from particle strikes have become a key challenge in microprocessor design. Techniques to deal with these transient faults exist, but come at a cost. Designers...
Shubhendu S. Mukherjee, Christopher T. Weaver, Joe...
121
Voted
DAC
2003
ACM
15 years 6 months ago
4G terminals: how are we going to design them?
Fourth-generation wireless communication systems (4G) will have totally different requirements than what front-end designers have been coping with up to now. Designs must be targe...
Jan Craninckx, Stéphane Donnay
98
Voted
ISPD
2003
ACM
105views Hardware» more  ISPD 2003»
15 years 6 months ago
Partition-driven standard cell thermal placement
The thermal problem has been emerged as one of the key issues for next-generation IC design. In this paper, we propose a scheme to achieve better thermal distribution for partitio...
Guoqiang Chen, Sachin S. Sapatnekar