6 search results - page 1 / 2 » Optical routing for 3D system-on-package |
GLVLSI
2005
IEEE
15 years 5 months ago
2005
IEEE
3D packaging via System-On-Package (SOP) is a viable alternative to System-On-Chip (SOC) to meet the rigorous requirements of today’s mixed signal system integration. In this wo...
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3DIC
2009
IEEE
15 years 2 months ago
2009
IEEE
Abstract— Networks-on-chip (NoC) is emerging as a key onchip communication architecture for multiprocessor systemson-chip (MPSoC). In traditional electronic NoCs, high bandwidth ...
DATE
2006
IEEE
15 years 5 months ago
2006
IEEE
Abstract— Optical interconnects enable faster signal propagation with virtually no crosstalk. In addition, wavelength division multiplexing allows a single waveguide to be shared...
DAC
2007
ACM
15 years 3 months ago
2007
ACM
This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a repl...
TPDS
1998
14 years 11 months ago
1998
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...