1339 search results - page 227 / 268 » Optimal layered multicast |
ISQED
2010
IEEE
15 years 7 months ago
2010
IEEE
—Double patterning lithography (DPL) provides an attractive alternative or a supplementary method to enable the 32nm and 22nm process nodes, relative to costlier technology optio...
106
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ICNP
2009
IEEE
15 years 7 months ago
2009
IEEE
—With advances in energy harvesting techniques, it is now feasible to build sustainable sensor networks (SSN) to support long-term applications. Unlike battery-powered sensor net...
113
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ASPDAC
2009
ACM
15 years 7 months ago
2009
ACM
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
113
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BROADNETS
2007
IEEE
15 years 6 months ago
2007
IEEE
— Network dimensioning for wavelength-routed WDM networks has been extensively studied to maximize connection acceptance rate while minimizing the total cost. However, Internet s...
103
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VTC
2007
IEEE
15 years 6 months ago
2007
IEEE
— Hydra is a flexible wireless network testbed being developed at UT Austin. Our focus is networks that support multiple wireless hops and where the network, especially the MAC,...