92 search results - page 6 / 19 » Optimization of shield structures in analog integrated circu... |
101
click to vote
DAC
2000
ACM
15 years 4 months ago
2000
ACM
Abstract: This paper presents a new statistical methodology to simulate the effect of both inter-die and intra-die variation on the electrical performance of analog integrated circ...
107
Voted
DAC
2011
ACM
13 years 11 months ago
2011
ACM
This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
DATE
2010
IEEE
15 years 4 months ago
2010
IEEE
—Integrated circuit process technology is entering the ultra deep submicron era. At this level, interconnect structure becomes very stiff and the metal resistance shielding effec...
89
Voted
DAC
2009
ACM
16 years 19 days ago
2009
ACM
Efficient system-level design is increasingly relying on hierarchical design-space exploration, as well as compositional methods, to shorten time-to-market, leverage design re-use...
88
Voted
TC
2002
14 years 11 months ago
2002
This paper presents a novel number system based on signed continuous valued digits. Arithmetic operations in this number system are performed using simple analog circuitry, in con...