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173
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DAC
2011
ACM
13 years 9 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
81
Voted
DAC
2008
ACM
15 years 10 months ago
2008
ACM
In this paper, we present ELIAD, an efficient lithography aware detailed router to optimize silicon image after optical proximity correction (OPC) in a correct-by-construction man...
FPGA
2010
ACM
15 years 6 months ago
2010
ACM
Placement based on simulated annealing is in dominant use in the FPGA community due to its superior quality of result (QoR). However, given the progression of FPGA device capacity...
ADHOCNOW
2009
Springer
15 years 4 months ago
2009
Springer
Abstract. Robots coordinate among themselves to select one of them to respond to an event reported to one of robots. The goal is to minimize the communication cost of selecting bes...
86
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ASPDAC
2009
ACM
15 years 4 months ago
2009
ACM
— Power distribution networks (PDNs) are designed and analyzed iteratively. Random walk is among the most efficient methods for PDN analysis. We develop in this paper an increme...