—Intelligent mobile terminals (or users) of next generation wireless networks are expected to initiate voice over IP (VoIP) calls using session set-up protocols like H.323 or SIP...
: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
Abstract—In packet communication systems, a header is attached to the transmitted packet at each layer. The overhead due to the transmission of the individual header can have a s...
Abstract. Domain-Specific Languages (DSLs) represent a proven approach to raising the abstraction level of programming. They offer highlevel constructs and notations dedicated to...
When similarity queries over multimedia databases are processed by splitting the overall query condition into a set of sub-queries, the problem of how to efficiently and effectiv...
Ilaria Bartolini, Paolo Ciaccia, Vincent Oria, M. ...