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TPDS
2010
14 years 10 months ago
2010
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
ISQED
2010
IEEE
15 years 6 months ago
2010
IEEE
SC
2009
ACM
2009
ACM
Memory-efficient optimization of Gyrokinetic particle-to-grid interpolation for multicore processors
15 years 6 months ago
DATE
2009
IEEE
15 years 6 months ago
2009
IEEE
Abstract—Advances in chip-multiprocessor processing capabilities has led to an increased power consumption and temperature hotspots. Maintaining the on-chip temperature is import...
SASP
2009
IEEE
15 years 6 months ago
2009
IEEE
