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99
Voted
ASPDAC
2009
ACM
104views Hardware» more  ASPDAC 2009»
15 years 10 months ago
Addressing thermal and power delivery bottlenecks in 3D circuits
— The enhanced packing densities facilitated by 3D integrated circuit technology also has an unwanted side-effect, in the form of increasing the amount of current per unit footpr...
Sachin S. Sapatnekar
131
Voted
DOCENG
2009
ACM
15 years 10 months ago
Creation and maintenance of multi-structured documents
In this article, we introduce a new problem: the construction of multi-structured documents. We first offer an overview of existing solutions to the representation of such docum...
Pierre-Edouard Portier, Sylvie Calabretto
122
Voted
ITICSE
2009
ACM
15 years 10 months ago
Evaluating student experiences in developing software for humanity
Student involvement in Humanitarian Free and Open Source Software (HFOSS) projects holds the potential to provide a rich education experience to undergraduates. This paper discuss...
Gregory W. Hislop, Heidi J. C. Ellis, Ralph A. Mor...
125
Voted
ITICSE
2009
ACM
15 years 10 months ago
The use of a controlled wireless testbed in courses
Wireless networking has become a popular topic in both undergraduate and graduate courses. However, putting together good assignments in wireless networking is difficult because t...
Peter Steenkiste
137
Voted
UBIMOB
2009
ACM
154views Management» more  UBIMOB 2009»
15 years 10 months ago
SoCQ: a pervasive environment management system
Pervasive systems give an overview of what digital environments should look like in the future. SoCQ takes a data-oriented perspective on the pervasive environment through a uni...
Yann Gripay, Frédérique Laforest, Je...