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TMC
2008
91views more  TMC 2008»
15 years 3 months ago
Efficient and Resilient Backbones for Multihop Wireless Networks
We consider the problem of finding "backbones" in multihop wireless networks. The backbone provides end-toend connectivity, allowing non-backbone nodes to save energy sin...
Seungjoon Lee, Bobby Bhattacharjee, Aravind Sriniv...
IEEECSA
2009
15 years 28 days ago
Multiratecast in Wireless Fault Tolerant Sensor and Actuator Networks
We study the multicast problem in wireless sensor networks, where the source can send data to a fixed number of destinations (actuators) at a different rate (multiratecast). A typi...
Xuehong Liu, Arnaud Casteigts, Nishith Goel, Amiya...
DAC
2007
ACM
16 years 4 months ago
Placement of 3D ICs with Thermal and Interlayer Via Considerations
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
Brent Goplen, Sachin S. Sapatnekar
ICCD
2001
IEEE
106views Hardware» more  ICCD 2001»
16 years 3 days ago
Pre-routing Estimation of Shielding for RLC Signal Integrity
The formiila-based I<,JJ model is a figiire of merit for the inductive coirpling, and has been used to solve the simrrltaneoris shield insertion and net ordering (SINO) and sim...
James D. Z. Ma, Arvind Parihar, Lei He
DATE
2009
IEEE
112views Hardware» more  DATE 2009»
15 years 10 months ago
Package routability- and IR-drop-aware finger/pad assignment in chip-package co-design
—Due to increasing complexity of design interactions between the chip, package and PCB, it is essential to consider them at the same time. Specifically the finger/pad locations...
Chao-Hung Lu, Hung-Ming Chen, Chien-Nan Jimmy Liu,...