Modern VLSI technology has changed the economic rules by which the balance between processing power, memory and communications is decided in computing systems. This will have a pr...
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
With increasingly smaller feature sizes and higher on-chip densities, the power dissipation of VLSI systems has become a primary concern for designers. This paper first describes...
A programmable single-chip multiprocessor system for video coding has been developed. The system is implemented in a high-performance 0.25 m logic/embedded DRAM process. It integr...
We present a configuration technique for a Large Area Integrated Circuit (LAIC) which is manufactured by wafer stepping. A LAIC consists of four identical subsystems, i.e., a subs...
Markus Rudack, Michael Redeker, Dieter Treytnar, O...