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CODES
2007
IEEE
15 years 7 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
SIGMOD
2009
ACM
172views Database» more  SIGMOD 2009»
15 years 8 months ago
Self-organizing tuple reconstruction in column-stores
Column-stores gained popularity as a promising physical design alternative. Each attribute of a relation is physically stored as a separate column allowing queries to load only th...
Stratos Idreos, Martin L. Kersten, Stefan Manegold
INFOCOM
2006
IEEE
15 years 7 months ago
DFT-MSN: The Delay/Fault-Tolerant Mobile Sensor Network for Pervasive Information Gathering
Abstract— This paper focuses on the Delay/Fault-Tolerant Mobile Sensor Network (DFT-MSN) for pervasive information gathering. We develop simple and efficient data delivery schem...
Yu Wang, Hongyi Wu
DIM
2008
ACM
15 years 3 months ago
Minimal information disclosure with efficiently verifiable credentials
Public-key based certificates provide a standard way to prove one's identity, as attested by some certificate authority (CA). However, plain certificates provide a binary ide...
David Bauer, Douglas M. Blough, David Cash
CONCURRENCY
2010
130views more  CONCURRENCY 2010»
15 years 1 months ago
Enabling high-speed asynchronous data extraction and transfer using DART
As the complexity and scale of current scientific and engineering applications grow, managing and transporting the large amounts of data they generate is quickly becoming a signif...
Ciprian Docan, Manish Parashar, Scott Klasky