Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
Samson Melamed, Thorlindur Thorolfsson, Adi Sriniv...
As the disks typically found in personal computers grow larger, protecting data by replicating it on a collection of “peer” systems rather than on dedicated high performance s...
Dmitry Brodsky, Michael J. Feeley, Norman C. Hutch...
VLSI engineers have traditionally used a variety of CAD analysis tools (e.g. SPICE) to deal with variability. As we go into deep sub micron issues, the analysis is becoming harder...
Sani R. Nassif, Vijay Pitchumani, N. Rodriguez, De...
Optical networking may dramatically change high performance distributed computing. One reason is that optical networks can support provisioning dynamically configurable lightpath...
John R. Lange, Ananth I. Sundararaj, Peter A. Dind...
Recent studies show that state-space dynamics of randomly initialized recurrent neural network (RNN) has interesting and potentially useful properties even without training. More p...