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» Performance Modeling of MANET Interconnectivity
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3DIC
2009
IEEE
153views Hardware» more  3DIC 2009»
15 years 4 months ago
Junction-level thermal extraction and simulation of 3DICs
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
Samson Melamed, Thorlindur Thorolfsson, Adi Sriniv...
SRDS
2006
IEEE
15 years 3 months ago
Topology Sensitive Replica Selection
As the disks typically found in personal computers grow larger, protecting data by replicating it on a collection of “peer” systems rather than on dedicated high performance s...
Dmitry Brodsky, Michael J. Feeley, Norman C. Hutch...
DAC
2006
ACM
15 years 3 months ago
Variation-aware analysis: savior of the nanometer era?
VLSI engineers have traditionally used a variety of CAD analysis tools (e.g. SPICE) to deal with variability. As we go into deep sub micron issues, the analysis is becoming harder...
Sani R. Nassif, Vijay Pitchumani, N. Rodriguez, De...
HPDC
2005
IEEE
15 years 3 months ago
Automatic dynamic run-time optical network reservations
Optical networking may dramatically change high performance distributed computing. One reason is that optical networks can support provisioning dynamically configurable lightpath...
John R. Lange, Ananth I. Sundararaj, Peter A. Dind...
SOFSEM
2004
Springer
15 years 2 months ago
Approaches Based on Markovian Architectural Bias in Recurrent Neural Networks
Recent studies show that state-space dynamics of randomly initialized recurrent neural network (RNN) has interesting and potentially useful properties even without training. More p...
Matej Makula, Michal Cernanský, Lubica Benu...