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ICCAD
2005
IEEE
110views Hardware» more  ICCAD 2005»
15 years 6 months ago
Performance analysis of carbon nanotube interconnects for VLSI applications
The work in this paper analyses the applicability of carbon nanotube (CNT) bundles as interconnects for VLSI circuits, while taking into account the practical limitations in this ...
Navin Srivastava, Kaustav Banerjee
ASPDAC
2007
ACM
122views Hardware» more  ASPDAC 2007»
15 years 1 months ago
Predicting the Performance and Reliability of Carbon Nanotube Bundles for On-Chip Interconnect
Single-walled carbon nanotube (SWCNT) bundles have the potential to provide an attractive solution for the resistivity and electromigration problems faced by traditional copper int...
Arthur Nieuwoudt, Mosin Mondal, Yehia Massoud
DAC
2006
ACM
15 years 3 months ago
A high density, carbon nanotube capacitor for decoupling applications
We present a novel application for carbon nanotube devices, implementing a high density 3-D capacitor, which can be useful for decoupling applications to reduce supply voltage var...
Mark M. Budnik, Arijit Raychowdhury, Aditya Bansal...
ASPDAC
2009
ACM
137views Hardware» more  ASPDAC 2009»
15 years 1 months ago
Reconfigurable double gate carbon nanotube field effect transistor based nanoelectronic architecture
-- Carbon nanotubes (CNTs) and carbon nanotube field effect transistors (CNFETs) have demonstrated extraordinary properties and are widely accepted as the building blocks of next g...
Bao Liu
VLSID
2009
IEEE
144views VLSI» more  VLSID 2009»
15 years 10 months ago
Exploring Carbon Nanotube Bundle Global Interconnects for Chip Multiprocessor Applications
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck in ultra-deep submicron (UDSM) technologies. C...
Sudeep Pasricha, Nikil Dutt, Fadi J. Kurdahi