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ICCAD
2010
IEEE
216views Hardware» more  ICCAD 2010»
15 years 3 months ago
Stress-driven 3D-IC placement with TSV keep-out zone and regularity study
Through-silicon via (TSV) fabrication causes tensile stress around TSVs which results in significant carrier mobility variation in the devices in their neighborhood. Keep-out zone ...
Krit Athikulwongse, Ashutosh Chakraborty, Jae-Seok...
CHI
2010
ACM
16 years 11 days ago
Usable gestures for mobile interfaces: evaluating social acceptability
Gesture-based mobile interfaces require users to change the way they use technology in public settings. Since mobile phones are part of our public appearance, designers must integ...
Julie Rico, Stephen A. Brewster
MOBISYS
2003
ACM
16 years 5 months ago
Tactics-Based Remote Execution for Mobile Computing
Remote execution can transform the puniest mobile device into a computing giant able to run resource-intensive applications such as natural language translation, speech recognitio...
Rajesh Krishna Balan, Mahadev Satyanarayanan, SoYo...
WICOMM
2002
121views more  WICOMM 2002»
15 years 5 months ago
Open issues on TCP for mobile computing
We discuss the design principles of TCP within the context of heterogeneous wired/wireless networks and mobile networking. We identify three shortcomings in TCP's behavior: (...
Vassilios Tsaoussidis, Ibrahim Matta
ICESS
2007
Springer
15 years 11 months ago
An Efficient Buffer Management Scheme for Implementing a B-Tree on NAND Flash Memory
Recently, NAND flash memory has been used for a storage device in various mobile computing devices such as MP3 players, mobile phones and laptops because of its shock-resistant, lo...
Hyun-Seob Lee, Sangwon Park, Ha-Joo Song, Dong-Ho ...