We consider the problem of optimizing the performance of a latency-insensitive system (LIS) where the addition of backpressure has caused throughput degradation. Previous works ha...
Inter-wire coupling is a major source of power consumption and delay faults for on-chip buses implemented in UDSM SoC Systems. Elimination or minimization of such faults is crucia...
Abstract--To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous res...
Chunyang Feng, Hai Zhou, Changhao Yan, Jun Tao, Xu...
The ever increasing gap between processor and memory speed, sometimes referred to as the Memory Wall problem [42], has a very negative impact on performance. This mismatch will be...
This paper introduces project TITAN, which investigates an alternative construct of residential broadband access. The aim of the project is to increase the utilisation of deployed...