In this paper, a new architecture called the extendable instruction set computer (EISC) is introduced that addresses the issues of memory size and performance in embedded micropro...
Packaging costs of Micro-Electro-Mechanical System (MEMS) are still contributing with >50% to the total costs of most devices. Aligned wafer bonding techniques for Wafer-level ...
Herwig Kirchberger, Paul Lindler, Markus Wimplinge...
Texture mapping with vector graphics, rather than raster graphics generates better rendering quality. This paper discusses a fully developed approach of texture mapping 3D objects...
Monitoring the resources of distributed systems is essential to the successful deployment and execution of grid applications, particularly when such applications have welldefined...
Sandip Agarwala, Christian Poellabauer, Jiantao Ko...
The rapid growth and development of wireless communication services and applications corresponds to an increase in associated energy consumption. For broadband wireless network de...
Moshe T. Masonta, Mjumo Mzyece, Ntsibane Ntlatlapa