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APCSAC
2001
IEEE
15 years 3 months ago
High-Performance Extendable Instruction Set Computing
In this paper, a new architecture called the extendable instruction set computer (EISC) is introduced that addresses the issues of memory size and performance in embedded micropro...
Heui Lee, Paul Becket, Bill Appelbe
82
Voted
CORR
2008
Springer
84views Education» more  CORR 2008»
14 years 11 months ago
Novel Bonding technologies for wafer-level transparent packaging of MOEMS
Packaging costs of Micro-Electro-Mechanical System (MEMS) are still contributing with >50% to the total costs of most devices. Aligned wafer bonding techniques for Wafer-level ...
Herwig Kirchberger, Paul Lindler, Markus Wimplinge...
122
Voted
CGVR
2006
15 years 1 months ago
Texture Mapping with Vector Graphics: A Nested Mipmapping Solution
Texture mapping with vector graphics, rather than raster graphics generates better rendering quality. This paper discusses a fully developed approach of texture mapping 3D objects...
Wei Zhang, Yonggao Yang, Song Xing
HPDC
2003
IEEE
15 years 5 months ago
Resource-Aware Stream Management with the Customizable dproc Distributed Monitoring Mechanisms
Monitoring the resources of distributed systems is essential to the successful deployment and execution of grid applications, particularly when such applications have welldefined...
Sandip Agarwala, Christian Poellabauer, Jiantao Ko...
SAICSIT
2010
ACM
14 years 9 months ago
Towards energy efficient mobile communications
The rapid growth and development of wireless communication services and applications corresponds to an increase in associated energy consumption. For broadband wireless network de...
Moshe T. Masonta, Mjumo Mzyece, Ntsibane Ntlatlapa