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ICCAD
2007
IEEE
124views Hardware» more  ICCAD 2007»
16 years 2 months ago
3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
ICCAD
2003
IEEE
148views Hardware» more  ICCAD 2003»
16 years 2 months ago
Multi.Objective Hypergraph Partitioning Algorithms for Cut and Maximum Subdomain Degree Minimization
In this paper we present a family of multi-objective hypergraph partitioning algorithms based on the multilevel paradigm, which are capable of producing solutions in which both th...
Navaratnasothie Selvakkumaran, George Karypis
ICCAD
2002
IEEE
161views Hardware» more  ICCAD 2002»
16 years 2 months ago
Non-tree routing for reliability and yield improvement
We propose to introduce redundant interconnects for manufacturing yield and reliability improvement. By introducing redundant interconnects, the potential for open faults is reduc...
Andrew B. Kahng, Bao Liu, Ion I. Mandoiu
VEE
2010
ACM
291views Virtualization» more  VEE 2010»
16 years 2 days ago
Neon: system support for derived data management
Modern organizations face increasingly complex information management requirements. A combination of commercial needs, legal liability and regulatory imperatives has created a pat...
Qing Zhang, John McCullough, Justin Ma, Nabil Sche...
CHI
2010
ACM
15 years 12 months ago
Embodied social proxy: mediating interpersonal connection in hub-and-satellite teams
Current business conditions have given rise to distributed teams that are mostly collocated except for one remote member. These “hub-and-satellite” teams face the challenge of...
Gina Venolia, John C. Tang, Ruy Cervantes, Sara Bl...
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