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DATE
2010
IEEE
142views Hardware» more  DATE 2010»
15 years 2 months ago
Testing TSV-based three-dimensional stacked ICs
To meet customer’s product-quality expectations, each individual IC needs to be tested for manufacturing defects incurred during its many high-precision, and hence defect-prone ...
Erik Jan Marinissen
DATE
2010
IEEE
131views Hardware» more  DATE 2010»
15 years 2 months ago
Spinto: High-performance energy minimization in spin glasses
—With the prospect of atomic-scale computing, we study cumulative energy profiles of spin-spin interactions in nonferromagnetic lattices (Ising spin-glasses)—an established to...
Héctor J. Garcia, Igor L. Markov
ICDCS
2002
IEEE
15 years 2 months ago
Process Migration: A Generalized Approach Using a Virtualizing Operating System
Process migration has been used to perform specialized tasks, such as load sharing and checkpoint/restarting long running applications. Implementation typically consists of modifi...
Tom Boyd, Partha Dasgupta
NDSS
2002
IEEE
15 years 2 months ago
Talking to Strangers: Authentication in Ad-Hoc Wireless Networks
In this paper we address the problem of secure communication and authentication in ad-hoc wireless networks. This is a difficult problem, as it involves bootstrapping trust betwe...
Dirk Balfanz, Diana K. Smetters, Paul Stewart, H. ...
WETICE
2002
IEEE
15 years 2 months ago
On Communication Security in Wireless Ad-Hoc Sensor Networks
Networks of wireless microsensors for monitoring physical environments have emerged as an important new application area for the wireless technology. Key attributes of these new t...
Sasha Slijepcevic, Miodrag Potkonjak, Vlasios Tsia...