Previous systems have explored the challenges of designing an interface for automotive styling which combine the metaphor of 2D drawing using physical tape with the simultaneous c...
Tovi Grossman, Ravin Balakrishnan, Gordon Kurtenba...
Because it takes time and trust to establish agreement, traditional consensus-based architectural styles cannot safely accommodate resources that change faster than it takes to tr...
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...
In deep submicron VLSI circuits, interconnect reliability due to electromigration and thermal effects is fast becoming a serious design issue particularly for long signal lines. T...
Wireless sensor networks (WSNs) deployed for missioncritical applications face the fundamental challenge of meeting stringent spatiotemporal performance requirements using nodes w...
Guoliang Xing, Jianping Wang, Ke Shen, Qingfeng Hu...