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CHI
2002
ACM
15 years 10 months ago
Creating principal 3D curves with digital tape drawing
Previous systems have explored the challenges of designing an interface for automotive styling which combine the metaphor of 2D drawing using physical tape with the simultaneous c...
Tovi Grossman, Ravin Balakrishnan, Gordon Kurtenba...
ICSE
2004
IEEE-ACM
15 years 10 months ago
Extending the Representational State Transfer (REST) Architectural Style for Decentralized Systems
Because it takes time and trust to establish agreement, traditional consensus-based architectural styles cannot safely accommodate resources that change faster than it takes to tr...
Rohit Khare, Richard N. Taylor
ICCD
2007
IEEE
225views Hardware» more  ICCD 2007»
15 years 6 months ago
Fine grain 3D integration for microarchitecture design through cube packing exploration
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...
ICCAD
2001
IEEE
100views Hardware» more  ICCAD 2001»
15 years 6 months ago
Coupled Analysis of Electromigration Reliability and Performance in ULSI Signal Nets
In deep submicron VLSI circuits, interconnect reliability due to electromigration and thermal effects is fast becoming a serious design issue particularly for long signal lines. T...
Kaustav Banerjee, Amit Mehrotra
ICDCS
2008
IEEE
15 years 4 months ago
Mobility-Assisted Spatiotemporal Detection in Wireless Sensor Networks
Wireless sensor networks (WSNs) deployed for missioncritical applications face the fundamental challenge of meeting stringent spatiotemporal performance requirements using nodes w...
Guoliang Xing, Jianping Wang, Ke Shen, Qingfeng Hu...