As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Compared to the last decades, we have recently seen more and more governmental applications which are provided via the Internet directly to the citizens. Due to the long history o...
Andreas Ekelhart, Stefan Fenz, Thomas Neubauer, Ed...
Abstract. Recently, researchers have explored to provide a queue management scheme with differentiated loss guarantees for the future Internet. The Bounded Random Drop (BRD), known...
This paper presents the main concepts of the IST Project FAIN "Future Active IP Networks" [10], a three-year collaborative research project, whose main task is to develo...
Alex Galis, Bernhard Plattner, Jonathan M. Smith, ...
In the Biodiversity World (BDW) project we have created a flexible and extensible Web Services-based Grid environment for biodiversity researchers to solve problems in biodiversity...
Jaspreet Singh Pahwa, Peter Brewer, Tim Sutton, Ch...