Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...
This paper explores the multi-dimensional design space for chip multiprocessors, exploring the inter-related variables of core count, pipeline depth, superscalar width, L2 cache s...
Yingmin Li, Benjamin C. Lee, David Brooks, Zhigang...
High mask and production costs for the newest CMOS silicon technologies increase the pressure to develop hardware platforms useable for different applications or variants of the s...
Christian Panis, Ulrich Hirnschrott, Gunther Laure...
We apply a scalable approach for practical, comprehensive design space evaluation and optimization. This approach combines design space sampling and statistical inference to ident...
We propose in this paper an original design space exploration method for reconfigurable architectures adapted to fine and coarse grain resources. The exploration flow deals with c...