Heat is a main concern for processors in deep sub-micron technologies. The chip temperature is affected by both the power consumption of processor components and the chip layout....
Designing custom solutions has been central to meeting a range of stringent and specialized needs of embedded computing, along such dimensions as physical size, power consumption, ...
Krishna V. Palem, Lakshmi N. Chakrapani, Sudhakar ...
The paper presents two new approaches to multiobjective design space exploration for parametric VLSI systems. Both considerably reduce the number of simulations needed to determin...
— The constant increase in levels of integration and the reduction of the time-to-market have led to the definition of new methodologies stressing reuse. This involves not only ...
Giuseppe Ascia, Vincenzo Catania, Maurizio Palesi,...
When designing heterogeneous MP-SoCs designers have to take into account various objectives such as power, die size, flexibility, performance or programmability. But to be able t...