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DATE
2006
IEEE
152views Hardware» more  DATE 2006»
15 years 3 months ago
Adaptive chip-package thermal analysis for synthesis and design
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
Yonghong Yang, Zhenyu (Peter) Gu, Changyun Zhu, Li...
SIGMOD
2011
ACM
331views Database» more  SIGMOD 2011»
14 years 14 days ago
Query optimization techniques for partitioned tables
Table partitioning splits a table into smaller parts that can be accessed, stored, and maintained independent of one another. From their traditional use in improving query perform...
Herodotos Herodotou, Nedyalko Borisov, Shivnath Ba...
JMLC
2000
Springer
15 years 1 months ago
Modularisation of Software Configuration Management
The principle of modularisation is one of the main techniques that software designers use to tame the complexity of programming. A software project, however, is complex in many oth...
Henrik Bærbak Christensen
79
Voted
ASPDAC
2010
ACM
168views Hardware» more  ASPDAC 2010»
14 years 7 months ago
Hybrid dynamic energy and thermal management in heterogeneous embedded multiprocessor SoCs
Heterogeneous multiprocessor system-on-chips (MPSoCs) which consist of cores with various power and performance characteristics can customize their configuration to achieve higher ...
Shervin Sharifi, Ayse Kivilcim Coskun, Tajana Simu...
68
Voted
FTEDA
2008
75views more  FTEDA 2008»
14 years 9 months ago
Thermally Aware Design
With greater integration, the power dissipation in integrated circuits has begun to outpace the ability of today's heat sinks to limit the on-chip temperature. As a result, t...
Yong Zhan, Sanjay V. Kumar, Sachin S. Sapatnekar