—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
With the advent and subsequent popularity of portable computers, power management of system components has become an important issue. Current portable computers implement a number...
Kester Li, Roger Kumpf, Paul Horton, Thomas E. And...
Power aware computing has become popular recently and many techniques have been proposed to manage the energy consumption for traditional real-time applications. We have previousl...
Dakai Zhu, Nevine AbouGhazaleh, Daniel Mossé...
As the number of computing and storage nodes keeps increasing, the interconnection network is becoming a key element of many computing and communication systems, where the overall...
A hierarchical scheme with cells and modules is crucial for managing design complexity during a large integrated circuit design. We present a methodology for thermal aware cell-ba...