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» Power distribution paths in 3-D ICS
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GLVLSI
2009
IEEE
262views VLSI» more  GLVLSI 2009»
13 years 3 months ago
Power distribution paths in 3-D ICS
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...
Vasilis F. Pavlidis, Giovanni De Micheli
DATE
2009
IEEE
161views Hardware» more  DATE 2009»
14 years 27 days ago
Co-design of signal, power, and thermal distribution networks for 3D ICs
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
Young-Joon Lee, Yoon Jo Kim, Gang Huang, Muhannad ...
DAC
2012
ACM
11 years 8 months ago
Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
Xin Zhao, Michael Scheuermann, Sung Kyu Lim
DATE
2009
IEEE
154views Hardware» more  DATE 2009»
14 years 27 days ago
Reliability aware through silicon via planning for 3D stacked ICs
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
Amirali Shayan Arani, Xiang Hu, He Peng, Chung-Kua...
ICCAD
2009
IEEE
136views Hardware» more  ICCAD 2009»
13 years 3 months ago
Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
Young-Joon Lee, Rohan Goel, Sung Kyu Lim