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FTEDA
2008
75views more  FTEDA 2008»
14 years 12 months ago
Thermally Aware Design
With greater integration, the power dissipation in integrated circuits has begun to outpace the ability of today's heat sinks to limit the on-chip temperature. As a result, t...
Yong Zhan, Sanjay V. Kumar, Sachin S. Sapatnekar
ECCC
2000
59views more  ECCC 2000»
14 years 11 months ago
A Simple Model for Neural Computation with Firing Rates and Firing Correlations
A simple extension of standard neural network models is introduced which provides a model for neural computations that involve both firing rates and firing correlations. Such an ex...
Wolfgang Maass
VLSID
2010
IEEE
190views VLSI» more  VLSID 2010»
14 years 10 months ago
Rethinking Threshold Voltage Assignment in 3D Multicore Designs
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
Koushik Chakraborty, Sanghamitra Roy
TVCG
2012
182views Hardware» more  TVCG 2012»
13 years 2 months ago
ISP: An Optimal Out-of-Core Image-Set Processing Streaming Architecture for Parallel Heterogeneous Systems
—Image population analysis is the class of statistical methods that plays a central role in understanding the development, evolution and disease of a population. However, these t...
Linh K. Ha, Jens Krüger, João Luiz Dih...
EENERGY
2010
15 years 3 months ago
Energy saving and network performance: a trade-off approach
Power consumption of the Information and Communication Technology sector (ICT) has recently become a key challenge. In particular, actions to improve energy-efficiency of Internet...
Carla Panarello, Alfio Lombardo, Giovanni Schembra...