3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
We have developed a system architecture, measuring and modeling techniques, and algorithms for on-line power and energy optimization and thermal management. The starting point for...
An increasing amount of personal data is automatically gathered on servers by administrations, hospitals and private companies while several security surveys highlight the failure...
Nicolas Anciaux, Luc Bouganim, Yanli Guo, Philippe...
The emerging trend of larger number of cores or processors on a single chip in the server, desktop, and mobile notebook platforms necessarily demands larger amount of on-chip last...
This work presents a single-channel analog processor IC for the wireless biosignal monitor. This chip occupies a small die area of 0.52 mm2 and has a low power consumption of 0.75...
Chih-Jen Yen, Mely Chen Chi, Wen-Yaw Chung, Shing-...