232 search results - page 3 / 47 » Practical aspects of reliability analysis for IC designs |
TE
2010
13 years 29 days ago
2010
This paper describes how an intelligent chip architecture has allowed a large cohort of undergraduate students to be given effective practical insight into IC design, by designing ...
DAC
2012
ACM
11 years 8 months ago
2012
ACM
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
DELTA
2002
IEEE
13 years 11 months ago
2002
IEEE
Teaching the practical aspects of device and chip design in New Zealand presents many problems, including high manufacturing costs, long lead times, and the lack of local industry...
20
Voted
ASPDAC
2008
ACM
13 years 8 months ago
2008
ACM
The capability of predicting the temperature profile is critically important for timing estimation, leakage reduction, power estimation, hotspot avoidance and reliability concerns ...
DATE
2008
IEEE
14 years 21 days ago
2008
IEEE
The evaluation of extra-functional properties of embedded systems, such as reliability, timeliness, and energy consumption, as well as dealing with uncertainty, e.g., in the timin...