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» Practical aspects of reliability analysis for IC designs
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ICCAD
2006
IEEE
107views Hardware» more  ICCAD 2006»
15 years 6 months ago
Current path analysis for electrostatic discharge protection
The electrostatic discharge (ESD) problem has become a challenging reliability issue in nanometer circuit design. High voltages resulted from ESD might cause high current densitie...
Hung-Yi Liu, Chung-Wei Lin, Szu-Jui Chou, Wei-Ting...
ACMDIS
2000
ACM
15 years 2 months ago
Sitemaps, Storyboards, and Specifications: A Sketch of Web Site Design Practice
Through a study of web site design practice, we observed that web site designers employ multiple representations of web sites as they progress through the design process, and that...
Mark W. Newman, James A. Landay
77
Voted
DATE
2003
IEEE
135views Hardware» more  DATE 2003»
15 years 2 months ago
Creating Value Through Test
Test is often seen as a necessary evil; it is a fact of life that ICs have manufacturing defects and those need to be filtered out by testing before the ICs are shipped to the cu...
Erik Jan Marinissen, Bart Vermeulen, Robert Madge,...
73
Voted
DATE
2010
IEEE
121views Hardware» more  DATE 2010»
15 years 2 months ago
Properties of and improvements to time-domain dynamic thermal analysis algorithms
—Temperature has a strong influence on integrated circuit (IC) performance, power consumption, and reliability. However, accurate thermal analysis can impose high computation co...
Xi Chen, Robert P. Dick, Li Shang
DAC
2001
ACM
15 years 10 months ago
Analysis of On-Chip Inductance Effects using a Novel Performance Optimization Methodology for Distributed RLC Interconnects
This work presents a new and computationally efficient performance optimization technique for distributed RLC interconnects based on a rigorous delay computation scheme. The new o...
Kaustav Banerjee, Amit Mehrotra