I/O placement has always been a concern in modern IC design. Due to flip-chip technology, I/O can be placed throughout the whole chip without long wires from the periphery of the...
Hung-Ming Chen, I-Min Liu, Martin D. F. Wong, Muzh...
A relatively new technique for measuring the 3D structure of visual scenes is provided by time of flight (TOF) cameras. Reflections of modulated light waves are recorded by a pa...
Wireless sensor networks are ad hoc networks comprised mainly of small sensor nodes with limited resources, and are rapidly emerging as a technology for large-scale, lowcost, autom...
Structured link vector model (SLVM) is a recently proposed document representation that takes into account both structural and semantic information for measuring XML document simi...
This paper presents a practical technique to automatically compute approximations of polygonal representations of 3D objects. It is based on a previously developed model simplific...