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ICCAD
2009
IEEE
154views Hardware» more  ICCAD 2009»
14 years 11 months ago
Pad assignment for die-stacking System-in-Package design
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
DAC
2008
ACM
16 years 3 months ago
A progressive-ILP based routing algorithm for cross-referencing biochips
Due to recent advances in microfluidics technology, digital microfluidic biochips and their associated CAD problems have gained much attention, most of which has been devoted to d...
Ping-Hung Yuh, Sachin S. Sapatnekar, Chia-Lin Yang...
VLSID
2002
IEEE
98views VLSI» more  VLSID 2002»
16 years 2 months ago
On Test Scheduling for Core-Based SOCs
We present a mathematical model for the problem of scheduling tests for core-based system-on-chip (SOC) VLSI designs. Given a set of tests for each core in the SOC and a set of te...
Sandeep Koranne
ICCD
2008
IEEE
111views Hardware» more  ICCD 2008»
15 years 11 months ago
Test-access mechanism optimization for core-based three-dimensional SOCs
— Test-access mechanisms (TAMs) and test wrappers (e.g., the IEEE Standard 1500 wrapper) facilitate the modular testing of embedded cores in a core-based system-on-chip (SOC). Su...
Xiaoxia Wu, Yibo Chen, Krishnendu Chakrabarty, Yua...
IPPS
2009
IEEE
15 years 8 months ago
High-level estimation and trade-off analysis for adaptive real-time systems
We propose a novel design estimation method for adaptive streaming applications to be implemented on a partially reconfigurable FPGA. Based on experimental results we enable accu...
Ingo Sander, Jun Zhu, Axel Jantsch, Andreas Herrho...