157 search results - page 11 / 32 » Process Variation Aware Issue Queue Design |
DAC
2004
ACM
15 years 10 months ago
2004
ACM
Electrothermal couplings between supply voltage, operating frequency, power dissipation and die temperature have been shown to significantly impact the energy-delay-product (EDP) ...
DATE
2004
IEEE
15 years 1 months ago
2004
IEEE
In this paper, we present various challenges that arise in the delivery and exchange of multimedia information to mobile devices. Specifically, we focus on techniques for maintain...
VTC
2006
IEEE
15 years 3 months ago
2006
IEEE
In this paper, we present a network-aware source coding (NASC) approach for wireless broadcast channels with multiple sources. The proposed NSAC approach takes into account the in...
VLSID
2010
IEEE
14 years 8 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
ASPDAC
2007
ACM
15 years 1 months ago
2007
ACM
With semiconductor fabrication technologies scaled below 100 nm, the design-manufacturing interface becomes more and more complicated. The resultant process variability causes a nu...