Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Ky...
Augmented Reality (AR) has been acclaimed as one of the promising technologies for advancing future UbiComp (Ubiquitous Computing) environments. Despite a myriad of AR application...
An architecture and prototype implementation of an automation system for industrial 3-D digitization is described. Facilities for automated view planning, collision avoidance and ...
Clock tree synthesis is one of the most important and challenging problems in 3D ICs. The clock signals have to be delivered by through-silicon vias (TSVs) to different tiers with...
Chiao-Ling Lung, Yu-Shih Su, Shih-Hsiu Huang, Yiyu...