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DAC
2009
ACM
15 years 10 months ago
Exploring serial vertical interconnects for 3D ICs
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
Sudeep Pasricha
DAC
2011
ACM
13 years 9 months ago
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Ky...
CAD
2010
Springer
14 years 9 months ago
AR interfacing with prototype 3D applications based on user-centered interactivity
Augmented Reality (AR) has been acclaimed as one of the promising technologies for advancing future UbiComp (Ubiquitous Computing) environments. Despite a myriad of AR application...
Seungjun Kim, Anind K. Dey
3DIM
1999
IEEE
15 years 2 months ago
An Automation System for Industrial 3-D Laser Digitizing
An architecture and prototype implementation of an automation system for industrial 3-D digitization is described. Facilities for automated view planning, collision avoidance and ...
D. G. Lamb, D. L. Baird, Michael A. Greenspan
DAC
2011
ACM
13 years 9 months ago
Fault-tolerant 3D clock network
Clock tree synthesis is one of the most important and challenging problems in 3D ICs. The clock signals have to be delivered by through-silicon vias (TSVs) to different tiers with...
Chiao-Ling Lung, Yu-Shih Su, Shih-Hsiu Huang, Yiyu...