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116
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DAC
2009
ACM
16 years 9 days ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
116
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DAC
2011
ACM
13 years 11 months ago
2011
ACM
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
129
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CAD
2010
Springer
14 years 11 months ago
2010
Springer
Augmented Reality (AR) has been acclaimed as one of the promising technologies for advancing future UbiComp (Ubiquitous Computing) environments. Despite a myriad of AR application...
3DIM
1999
IEEE
15 years 3 months ago
1999
IEEE
An architecture and prototype implementation of an automation system for industrial 3-D digitization is described. Facilities for automated view planning, collision avoidance and ...
192
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DAC
2011
ACM
13 years 11 months ago
2011
ACM
Clock tree synthesis is one of the most important and challenging problems in 3D ICs. The clock signals have to be delivered by through-silicon vias (TSVs) to different tiers with...