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INFORMATICALT
2007
14 years 9 months ago
2007
The innovations and improvements in digital imaging sensors and scanners, computer modeling, haptic equipments and e-learning technology, as well as the availability of many powerf...
3DGIS
2006
Springer
15 years 3 months ago
2006
Springer
Database management systems (DBMS) have significantly changed in the last several years. From a system dealing with management of administrative data they have involved to a spati...
ICCAD
2004
IEEE
15 years 6 months ago
2004
IEEE
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...
ISVLSI
2003
IEEE
15 years 3 months ago
2003
IEEE
Three-dimensional integration technologies have been proposed in order to mitigate design challenges posed by deep-submicron interconnect. By providing multiple layers of active d...
ICCAD
2008
IEEE
15 years 6 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...