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ASPDAC
2007
ACM
164views Hardware» more  ASPDAC 2007»
15 years 1 months ago
Thermal-Aware 3D IC Placement Via Transformation
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
Jason Cong, Guojie Luo, Jie Wei, Yan Zhang
CISIS
2009
IEEE
15 years 4 months ago
Designing Regular Network-on-Chip Topologies under Technology, Architecture and Software Constraints
—Regular multi-core processors are appearing in the embedded system market as high performance software programmable solutions. The use of regular interconnect fabrics for them a...
Francisco Gilabert Villamón, Daniele Ludovi...
IJVR
2006
116views more  IJVR 2006»
14 years 9 months ago
New Directions in 3D User Interfaces
Three-dimensional user interfaces (3D UIs) support user tasks in many non-traditional interactive systems such as virtual environments, augmented reality, and ubiquitous computing...
Doug A. Bowman, Jian Chen, Chadwick A. Wingrave, J...
VW
1998
Springer
176views Virtual Reality» more  VW 1998»
15 years 1 months ago
A Mixed 2D/3D Interface for Music Spatialization
We propose a system for controlling in real time the localisation of sound sources. The system, called MidiSpace, is a real time spatializer of Midi music. We raise the issue of wh...
François Pachet, Olivier Delerue
ASAP
2007
IEEE
118views Hardware» more  ASAP 2007»
14 years 11 months ago
Evaluation of a Tightly Coupled ASIP / Co-Processor Architecture Used in GNSS Receivers
This paper presents the enhancement of an ASIP’s floating point performance by coupling of a co-processor and adding of special instructions. Processor hardware modifications an...
Götz Kappen, S. el Bahri, O. Priebe, Tobias G...