Caching techniques have been an efficient mechanism for mitigating the effects of the processor-memory speed gap. Traditional multi-level SRAM-based cache hierarchies, especially...
With aggressive reductions in feature sizes and the integration of multiple functionalities on the same die, bottlenecks due to I/O pin limitations have become a severe issue in to...
In the near future, semiconductor technology will allow the integration of multiple processors on a chip or multichipmodule (MCM). In this paper we investigate the architecture an...
System and processor architectures depend on changes in technology. Looking ahead as die density and speed increase, power consumption and on chip interconnection delay become incr...
As process technology migrates to deep submicron with feature size less than 100nm, global wire delay is becoming a major hindrance in keeping the latency of intra-chip communicat...
Mongkol Ekpanyapong, Jacob R. Minz, Thaisiri Watew...