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107
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SLIP
2005
ACM
15 years 4 months ago
2005
ACM
The interconnection architecture of FPGAs such as switches dominates performance of FPGAs. Three-dimensional integration of FPGAs overcomes interconnect limitations by allowing in...
123
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GLVLSI
2009
IEEE
15 years 6 months ago
2009
IEEE
In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a...
106
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DAC
2007
ACM
16 years 7 days ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
116
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3DIC
2009
IEEE
15 years 6 months ago
2009
IEEE
The first memristor, originally theorized by Dr. Leon Chua in 1971, was identified by a team at HP Labs in 2008. This new fundamental circuit element is unique in that its resis...
ASPLOS
2006
ACM
15 years 5 months ago
2006
ACM
While the number of transistors on a chip increases exponentially over time, the productivity that can be realized from these systems has not kept pace. To deal with the complexit...