707 search results - page 41 / 142 » Processor Architecture Design Using 3D Integration Technolog... |
SAC
2004
ACM
15 years 3 months ago
2004
ACM
High mask and production costs for the newest CMOS silicon technologies increase the pressure to develop hardware platforms useable for different applications or variants of the s...
CSCW
2008
ACM
14 years 10 months ago
2008
ACM
We conducted an ethnographic field study examining how a building design team used representational artifacts to coordinate the design of building systems, structure, and architect...
103
click to vote
WWW
2008
ACM
15 years 10 months ago
2008
ACM
Web search engines are facing formidable performance challenges due to data sizes and query loads. The major engines have to process tens of thousands of queries per second over t...
DATE
2005
IEEE
15 years 3 months ago
2005
IEEE
: - One of the main bottlenecks when designing a network processing system is very often its memory subsystem. This is mainly due to the state-of-the-art network links operating at...
TPDS
1998
14 years 9 months ago
1998
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...