Extending 2-D planar topologies in integrated circuits (ICs) to a 3-D implementation has the obvious benefits of reducing the overall footprint and average interconnection length,...
- This paper describes a new architectural paradigm for fully connected, single-hop system level interconnection networks. The architecture is scalable enough to meet the needs of ...
Kelli Ireland, Donald M. Chiarulli, Steven P. Levi...
The design and implementation of the reconstruction system in medical X-ray imaging is a challenging issue due to its immense computational demands. In order to ensure an efficien...
Holger Scherl, Stefan Hoppe, Markus Kowarschik, Jo...
Scan chains are widely used to improve the testability of IC designs. In traditional 2D IC designs, various design techniques on the construction of scan chains have been proposed...
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...