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DATE
2008
IEEE
129views Hardware» more  DATE 2008»
15 years 4 months ago
Memory Technology for Extended Large-Scale Integration in Future Electronics Applications
Extending 2-D planar topologies in integrated circuits (ICs) to a 3-D implementation has the obvious benefits of reducing the overall footprint and average interconnection length,...
Dinesh Pamunuwa
3DIC
2009
IEEE
146views Hardware» more  3DIC 2009»
15 years 4 months ago
A routerless system level interconnection network for 3D integrated systems
- This paper describes a new architectural paradigm for fully connected, single-hop system level interconnection networks. The architecture is scalable enough to meet the needs of ...
Kelli Ireland, Donald M. Chiarulli, Steven P. Levi...
ICSE
2008
IEEE-ACM
15 years 10 months ago
Design and implementation of the software architecture for a 3-D reconstruction system in medical imaging
The design and implementation of the reconstruction system in medical X-ray imaging is a challenging issue due to its immense computational demands. In order to ensure an efficien...
Holger Scherl, Stefan Hoppe, Markus Kowarschik, Jo...
ICCD
2007
IEEE
161views Hardware» more  ICCD 2007»
15 years 6 months ago
Scan chain design for three-dimensional integrated circuits (3D ICs)
Scan chains are widely used to improve the testability of IC designs. In traditional 2D IC designs, various design techniques on the construction of scan chains have been proposed...
Xiaoxia Wu, Paul Falkenstern, Yuan Xie
ICCD
2007
IEEE
225views Hardware» more  ICCD 2007»
15 years 6 months ago
Fine grain 3D integration for microarchitecture design through cube packing exploration
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...