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DAC
2006
ACM
15 years 11 months ago
2006
ACM
Substantial increase in leakage current and threshold voltage fluctuations are making design of robust wide fan-in dynamic gates a challenging task. Traditionally, a PMOS keeper t...
DAC
2010
ACM
15 years 1 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
MICRO
1998
IEEE
15 years 2 months ago
1998
IEEE
The inherent instruction-level parallelism (ILP) of current applications (specially those based on floating point computations) has driven hardware designers and compilers writers...
DATE
2009
IEEE
15 years 4 months ago
2009
IEEE
—It is generally acknowledged that nanoelectronics will eventually replace traditional silicon CMOS in high-performance integrated circuits. To that end, considerable investments...
NOCS
2007
IEEE
15 years 4 months ago
2007
IEEE
Recent remarkable advances in nanoscale siliconphotonic integrated circuitry specifically compatible with CMOS fabrication have generated new opportunities for leveraging the uni...