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ICCAD
2009
IEEE
154views Hardware» more  ICCAD 2009»
15 years 23 days ago
Pad assignment for die-stacking System-in-Package design
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
ICDAR
2009
IEEE
15 years 23 days ago
Towards Handwritten Mathematical Expression Recognition
In this paper, we propose a new framework for online handwritten mathematical expression recognition. The proposed architecture aims at handling mathematical expression recognitio...
Ahmad-Montaser Awal, Harold Mouchère, Chris...
ICWN
2009
15 years 22 days ago
Mobile Agents for Wireless Sensor Networks
Abstract-- The next generation of computers will be embossed by ubiquitous systems. The computer will disappear behind daily artifacts and will support people in their everyday lif...
Faruk Bagci, Julian Wolf, Theo Ungerer, Nader Bagh...
IGARSS
2009
15 years 22 days ago
Fog Forecasting, Detection and Monitoring in the UAE using SEVIRI-MSG Data
The UAE location on the edge of a very warm sea and hot and dry desert create the optimal conditions of inland fog forming. The afternoon sea breeze, which is almost a daily event...
Abdulla Bushahab, Ali Al Suwaidi, Hosni Ghedira, K...
FSTTCS
2010
Springer
15 years 11 days ago
The Complexity of Model Checking (Collapsible) Higher-Order Pushdown Systems
We study (collapsible) higher-order pushdown systems -- theoretically robust and well-studied models of higher-order programs -- along with their natural subclass called (collapsi...
Matthew Hague, Anthony Widjaja To
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